20 EIC-backed deeptech companies to exhibit at Mobile World Congress 2023

Brussels, January 13th 2023
Summary
  • The European Innovation Council organised a preparatory virtual workshop on 12 January 2023 ahead of MWC 2023.
  • 20 EIC-funded SMEs, start-ups and scale-ups were selected to exhibit at the EIC Pavilion at Mobile World Congress in Barcelona from 27 February to 2 March 2023.
  • The EIC delegation covers a broad technology spectrum from AI, ML and robotics to IoT, quantum computing and digital health simulation.
  • Speakers at the workshop included the Director of GSMA, representatives from ACCIO, and alumni entrepreneurs who shared practical pitching tips.
  • The EIC Overseas Trade Fairs Programme 2.0 supports selected EIC beneficiaries with coaching and matchmaking to maximise trade fair impact.

EIC takes 20 deeptech innovators to Mobile World Congress 2023

On 12 January 2023 the European Innovation Council (EIC) organised a virtual preparatory workshop for companies selected under its Overseas Trade Fairs Programme 2.0. The workshop was staged to prepare an EIC delegation of 20 EIC-funded SMEs, start-ups and scale-ups for Mobile World Congress (MWC) 2023. MWC is the world’s largest international trade fair for the mobile communications and telecoms industry and ran in Barcelona from 27 February to 2 March 2023.

Why MWC matters for deeptech startups

MWC is a major industry platform that mixes product launches, standards conversations, operator deals and partner matchmaking. For early stage and scaling deeptech companies the trade fair is an opportunity to showcase technology to a concentrated audience of carriers, device makers, enterprise customers, investors and press. But attendance alone does not guarantee commercial outcomes. Converting meetings into pilots or contracts typically requires prior market scoping, tight value propositions, follow-up resources and IP and regulatory preparedness.

Who the EIC delegation included

The EIC Pavilion at MWC 2023 brought together 20 companies that received EIC funding. The selection highlighted companies from across Europe and associated countries working in connectivity related and adjacent deeptech fields. The full list of exhibitors and their listed headquarters is below.

CompanyHeadquarters (country)
AmbeentTurkey
Applied NanolayersNetherlands
Billon GroupPoland
CodershipFinland
UltimateFinland
Elliptic LabsNorway
GalgusSpain
IQM Quantum ComputersFinland
JADBioGreece
Mo’Real UniverseRomania
Medical Simulation TechnologiesPoland
NIL TechnologyDenmark
OrbitalAdsSpain
OriginGPSIsrael
OutThinkUnited Kingdom
PhotonicSensSpain
ScantrustSwitzerland
SeluxitDenmark
SEQUENTIA BiotechSpain
TanazaItaly

Preparatory workshop: what was covered

The virtual workshop on 12 January provided practical support and briefings to the selected companies. Sessions focused on maximising networking, pitching and partnership opportunities at MWC. Attendees received an MWC preview and practical advice on how to structure outreach, pitch preparation and on-site presence.

Key speakers:Mark Callender, Director at GSMA, presented an overview of the tradeshow and emphasised the event's partnering and networking opportunities. Representatives from ACCIO, Catalonia’s business agency, offered advice on leveraging the trade fair to expand globally and communicate breakthrough ideas. Vicki Kolovou, Head of Marketing at JADBio and a previous participant in the OTF Programme 2.0, shared hands-on tips for preparing an effective pitch and trade fair strategy.

What the EIC Overseas Trade Fairs Programme 2.0 offers

The EIC OTF Programme 2.0 is designed to help EIC-supported companies internationalise by attending major trade fairs. The support package often includes matchmaking and mentoring, pavilion space at EU/EIC-branded areas, preparatory workshops and visibility through EIC channels. The programme aims to amplify the reach of promising European deeptech companies in strategic markets.

How companies are assessed for the programme:Applicants are generally evaluated on commercial readiness, internationalisation plans, fit with the trade fair, and the potential impact of participation. External experts and the EIC team typically review applications to select beneficiaries that can make the most of the trade fair exposure.

Technology scope in the EIC delegation

The exhibited companies represent a cross-section of connectivity and adjacent deeptech areas. The public description of the delegation highlighted digital technologies such as artificial intelligence, robotics, machine learning and the Internet of Things alongside creative mobile solutions and product design concepts. The selection also included quantum computing, secure digital ledgers and genomics or biotech companies indicating the breadth of applications that converge on mobile and connectivity ecosystems.

Why a broad technology mix matters:Trade fairs like MWC are no longer only about radio access networks or handsets. They are marketplaces for platforms and cross-cutting vertical solutions where AI, sensors, quantum-safe security, digital identity and IoT integrations intersect with telecom and enterprise needs. A varied delegation can open doors to cross-sector partnerships but it also raises challenges in communicating focused value propositions to different buyer types.

A pragmatic note on trade fair impact

Trade fairs deliver dense access to potential partners and customers but turning interest into pilots, procurement or investment takes work. Exhibitors need clear outreach and follow-up plans, resources for post-event sales development and careful attention to IP and regulatory considerations when discussing prototypes or novel technology in public settings. Preparatory workshops and mentoring that target these realities increase the likelihood of measurable outcomes.

Practical guidance distilled from the workshop

Pitch preparation and messaging:Focus on one measurable benefit for a specific buyer persona and rehearse a concise pitch that can be delivered repeatedly to different audiences. Tailor technical depth to the listener and have clear next steps to propose after initial interest.
Networking and matchmaking:Use matchmaking tools and curated meetings strategically. Prioritise conversations that map to immediate commercial milestones and follow up within days while the encounter is still fresh.
Regulatory and IP caution:Be prepared to discuss regulatory pathways, standards alignment and IP protections. Public demos can be useful but sensitive details are best handled in controlled meetings under non-disclosure arrangements.

What this means for the EIC and Europe’s deeptech ecosystem

The EIC Pavilion at MWC illustrates the EIC’s role in helping EU-backed innovators reach global markets. Trade fair participation can be an effective element of commercialisation if it is integrated into a wider go-to-market plan that includes market research, sales resources and regulatory readiness. For policymakers, showcasing a diversity of deeptech at major international shows helps signal European capability and can support technology diplomacy. For entrepreneurs, the opportunity is valuable but outcomes depend on rigorous preparation and disciplined post-event follow up.

Further information and next steps for interested companies

Companies interested in future EIC trade fair opportunities were directed to the EIC OTF Programme 2.0 page and the EIC Community platform for news, open calls and related events. The EIC Community Helpdesk is the contact point for questions on the programme and upcoming open calls.