EIC names 15 deep tech firms for GITEX AI Europe 2026 in Berlin

Brussels, May 7th 2026

Summary

›Fifteen EIC-backed companies will exhibit at GITEX AI Europe 2026 in Berlin from 30 June to 1 July.
›The cohort spans AI hardware, quantum, cybersecurity, robotics safety, edge computing, cleantech and fintech infrastructure.
›Participants receive exhibition space, tailored coaching, curated matchmaking and promotional support under the EIC International Trade Fairs Programme 3.0.
›GITEX’s reported 2025 attendance varies by source, and commercial outcomes are not yet independently tracked.

A focused EIC delegation heads to GITEX AI Europe 2026

The European Innovation Council will field a 15-company delegation at GITEX AI Europe 2026 in Berlin, Germany, on 30 June and 1 July. Backed by the EIC International Trade Fairs Programme 3.0 and delivered through the Business Acceleration Services, the cohort is positioned to showcase European deep tech capabilities to international investors, corporates and policymakers.

Why this event matters for Europe’s AI and deep tech agenda

GITEX AI Europe is marketed as a convening point for AI and next generation digital infrastructure in the region. The 2025 edition drew a large international crowd with reported figures diverging between sources. The EIC Community page cites more than 21,000 participants while a separate EIC news item referenced over 30,000 attendees. Such discrepancies are common in trade fair communications where counting methods differ. Either way, the event is large enough to justify a targeted European presence given the current push to translate public tech funding into market traction.

Headline themes in 2026 include next generation connectivity, AI and robotics, cybersecurity, quantum and data computing, cleantech and fintech. These mirror the core priorities of EU research and innovation policy and align with the EIC’s portfolio focus on deep tech companies that are capital intensive and face nontrivial paths to market.

What the EIC offers the selected firms

Under the International Trade Fairs Programme 3.0, the 15 firms receive a standardised package designed to convert visibility into pipeline. This includes a booth at the EIC Pavilion, tailored business coaching, curated investor and corporate matchmaking, and promotional support. The Pavilion will operate as a central hub for meetings, reverse pitches and side events.

EIC International Trade Fairs Programme 3.0:ITF 3.0 runs from 2024 to 2026 and gives EIC awardees access to 12 trade fairs across the EU, the MENA region and the United States. Beyond stand space, services cover pre-departure briefings, targeted coaching, B2B matchmaking and follow-up support. The programme is open via competitive calls to EIC-backed startups, scale-ups and SMEs from EU Member States and Associated Countries.

The 15-company delegation

The cohort blends cybersecurity for robotics, neuromorphic and AI processors, quantum software and hardware, energy efficient microelectronics, industrial sensing and connectivity, and applied automation in finance and logistics. Several companies originate from Associated Countries to Horizon Europe, reflecting the broader geographic footprint of the EIC community.

Company	Country	Focus as described by EIC
Alias Robotics	Spain	Cybersecurity and autonomous AI systems to protect robots and connected machines
Astrape Networks	Netherlands	High-performance networking to improve data centre efficiency and connectivity
CH-Bioforce	Finland	Biomass technology converting plant-based waste into sustainable textile and packaging materials
ClassiQ	Israel	Software platform for designing, optimising and scaling quantum algorithms and applications
Dronamics	Bulgaria	Cargo drone airline for faster and more efficient middle-mile logistics
Enersens	France	Advanced insulation materials to protect batteries and industrial systems from heat and fire
everox	Netherlands	Digital infrastructure solutions for performance, scalability and sustainability of cloud and data systems
Innatera	Netherlands	Ultra low power neuromorphic processors enabling real-time edge AI
Invoier	Sweden	AI-driven automation to streamline invoicing and optimise financial operations
Oledcomm	France	LiFi technology for high-speed secure wireless communication through light
OniO	Norway	Ultra low power wireless microcontrollers operating without batteries for sustainable IoT
SemiQon	Finland	Silicon-based quantum processors designed for scalability and cost efficiency
SpiNNcloud	Germany	High-performance neuromorphic computing platforms for AI workloads
VoxelSensors	Belgium	Advanced 3D perception and sensing for spatial awareness in consumer and industrial systems
Vsora	France	High-performance AI processors and semiconductor solutions for data-intensive and edge applications

Neuromorphic processors:Chips inspired by the structure and signaling of biological neural networks. They use spiking models or event-driven architectures to reduce power consumption and latency, which is valuable for edge AI tasks where on-device inference must be fast and efficient.

Batteryless microcontrollers:Ultra low power MCUs paired with energy harvesting from ambient sources such as light, radio frequency, vibration or thermal gradients. They target maintenance-free IoT nodes where replacing batteries is impractical or costly.

LiFi:Data transmission using modulated light from LEDs rather than radio frequencies. It offers high throughput in restricted environments and can be more secure as light does not pass through opaque walls, though it requires line-of-sight or reflective paths.

Middle-mile logistics by cargo drone:The middle mile connects warehouses or regional hubs before last-mile delivery. Fixed-route cargo drones target time sensitive shipments and hard-to-serve geographies. Scaling depends on airspace integration, ground handling, safety cases and cost per kilogram.

Silicon-based quantum processors:Quantum bits implemented using silicon processes aim to leverage mature CMOS manufacturing for scalability and potential cost advantages, but still face coherence, control and error correction challenges.

What happens before Berlin

In the run-up to the event, the selected firms will join an online pre-departure briefing with EIC staff and market experts to plan stand operations and schedule meetings. Additional coaching will refine narratives and pitches. Structured matchmaking includes reverse pitch sessions where corporates and investors present their needs, along with one-on-one meetings to qualify leads. The intent is to ensure teams arrive with a concrete plan and prebooked conversations rather than relying on footfall.

Reverse pitch:A format where buyers or investors explain their problem statements, procurement cycles and diligence criteria, allowing startups to target solutions precisely and avoid misaligned outreach.

Programme context and how to engage

The International Trade Fairs Programme 3.0 is one of several EIC Business Acceleration Services that supplement grants and equity investment. Alongside exposure at major fairs, the BAS portfolio includes corporate partnership activities, innovation procurement pathways and initiatives addressing persistent gaps such as the underrepresentation of women founders in venture capital allocations.

Upcoming ITF 3.0 trade fairs	Dates	Location
CES International	6-9 January 2026	Las Vegas, USA
Mobile World Congress	2-5 March 2026	Barcelona, Spain
GITEX Africa	7-9 April 2026	Marrakech, Morocco
BIO International Convention	22-25 June 2026	Boston, USA
GITEX Europe	30 June - 1 July 2026	Berlin, Germany
MEDICA	9-12 November 2026	Dusseldorf, Germany
GITEX Global	9-11 December 2026	Dubai, UAE

A realistic view on impact and measurement

Trade fairs can accelerate sales cycles when used to crystallise already-warm relationships. They can also soak up budget and time if not paired with disciplined lead qualification and post-event follow-up. The EIC’s offer of curated matchmaking and coaching is designed to mitigate these risks. However, independently audited metrics on conversion to pilots, purchase orders or follow-on investment are still limited in public reporting. Past EIC communications on GITEX Europe 2025 highlighted large audiences and active programming, but did not quantify closed deals attributable to the Pavilion. Companies should plan clear KPIs for meetings, trials and post-event cadence and treat headline attendance claims cautiously.

Practical notes, eligibility and contacts

The EIC International Trade Fairs Programme 3.0 is open to EIC-backed startups, scale-ups and SMEs from EU Member States and Associated Countries through open calls typically published six months before each fair on the EIC Community Platform. Selection is based on product fit with the fair, internationalisation readiness and commercial maturity. For questions on the programme, the EIC directs queries to the Community Helpdesk. The current instruction is to select the category EVENT – EIC ITF Programme – BIO 2026 in the contact form which indicates a shared triage queue rather than a dedicated GITEX category.

Associated Countries to Horizon Europe in EIC programmes:Non-EU countries that participate under conditions similar to Member States. This is why companies from Norway and Israel appear in EIC-backed delegations. Association status governs eligibility but not necessarily the availability of national co-funding or state aid rules.

Company list at a glance with domains

Domain	Representative companies	Example applications
Cybersecurity for robotics and machines	Alias Robotics	Safety and resilience in automated factories and service robots
AI compute and neuromorphic hardware	Innatera, SpiNNcloud, Vsora	Low power edge inference, scalable AI acceleration, industrial AI workloads
Quantum stack	ClassiQ, SemiQon	Algorithm design and optimisation, silicon qubits for scalable hardware
Next-gen connectivity and infrastructure	Astrape Networks, Oledcomm, everox	Data centre efficiency, optical wireless networking, cloud and data systems performance
Sensing and perception	VoxelSensors	3D spatial awareness for AR devices, robotics and industrial autonomy
Industrial safety and materials	Enersens	Thermal and fire protection for batteries and sensitive systems
Circular bio-based materials	CH-Bioforce	Textiles and packaging from biomass side streams
Logistics and aviation	Dronamics	Time sensitive middle-mile cargo operations
Fintech automation	Invoier	Invoice processing and working capital optimisation
Ultra low power IoT	OniO	Batteryless sensors for buildings, logistics, healthcare

Event fundamentals

Item	Details
Event	GITEX AI Europe 2026
Dates	30 June to 1 July 2026
Location	Berlin, Germany
Core themes	Next-generation connectivity, AI and robotics, cybersecurity, quantum and data computing, cleantech, fintech
EIC presence	EIC Pavilion, coaching, curated matchmaking, promotional support

Staying informed

EIC Business Acceleration Services maintains a newsletter and a monthly open-calls digest for upcoming delegations and partner opportunities. For application windows and programme changes, the EIC Community Platform remains the primary source of record. As always, the EIC notes that communications reflect knowledge sharing rather than an official position of the European Commission.

Disclaimer from the source: This information is provided in the interest of knowledge sharing and should not be interpreted as the official view of the European Commission or any other organisation.