EIC sends 15 deep tech companies to MWC 2026 with tailored trade fair support

Brussels, January 30th 2026

Summary

›The European Innovation Council will host 15 EIC-backed companies at the EIC Pavilion during Mobile World Congress Barcelona from 2 to 5 March 2026.
›Participants benefit from the EIC International Trade Fairs Programme 3.0 which provides booth space, personalised coaching, targeted matchmaking and visibility support.
›The delegation spans connectivity, photonics, quantum, AI security, medtech, semiconductors and energy innovations.
›A preparation programme includes an online pre-departure briefing on 3 February 2026 and follow-up coaching and structured matchmaking ahead of MWC.
›MWC and co-located 4YFN remain important commercial and investor stages but measurable commercial impact depends on follow-through and realistic scale-up capacity.

EIC Pavilion at MWC 2026: delegation, support and what to watch

The European Innovation Council has announced its delegation of 15 EIC-backed companies selected to exhibit at the EIC Pavilion during Mobile World Congress Barcelona 2026. MWC runs from 2 to 5 March 2026 and co-locates the 4YFN startup programme. This marks the EIC's fourth participation at MWC under the International Trade Fairs Programme 3.0, aimed at helping European deep-tech innovators access commercial partners, investors and overseas markets.

Why MWC and 4YFN matter for European deep tech

MWC remains one of the largest global gatherings for connectivity, telecommunications and adjacent digital sectors. The last edition drew roughly 109,000 attendees from about 205 countries. Co-located 4YFN focuses on startups and early scale-ups and typically brings together over 1,000 startups, investors and ecosystem players. For EIC beneficiaries, these events offer visibility and deal flow opportunities but success depends on preparation, follow-up and the ability to convert meetings into commercial pilots or funding rounds.

The delegation: 15 EIC-backed innovators

The selected companies cover a range of technologies that align with MWC 2026 themes including next-generation connectivity, AI-driven infrastructure, immersive ecosystems, and cross-industry digitalisation. Below is a structured overview of the delegation with company claims distilled for clarity.

Company	Country	What they say they do	Primary tech area
Cailabs	France	Shaping laser light to enable faster, safer and more precise solutions across industrial processes and data transmission including space applications.	Laser optics, free-space optical communications, photonics
danalto	Ireland	Simplifies massive scale IoT for asset tracking and management across wide outdoor and indoor areas.	IoT connectivity, large scale tracking
DeepKeep	Israel	Provides AI-native security and trustworthiness across the ML lifecycle from R&D to deployment.	AI security, model governance
Dimetor	Austria	Bridges telecom data with aviation systems using scalable platforms for situational awareness and PNT assurance.	Telecom analytics for aviation, PNT monitoring
Eodyne Systems	Spain	Offers affordable home rehabilitation and remote patient monitoring with augmented reality exercises.	Medtech, digital rehabilitation, AR
Last Mile Semiconductor	Germany	Develops the LM10XX NR+ System-on-Chip for low-power, secure wireless IoT using the NR+ non cellular 5G standard.	SoC for NR+ IoT, semiconductors
Mifundo	Estonia	Provides passportable cross-border credit data to reduce foreign credit risk and speed onboarding for banks.	Fintech, cross-border credit data
Oledcomm	France	Builds LiFi systems claiming ultra-fast, secure, interference free wireless connections using light.	LiFi, optical wireless communications
OQ Technology	Luxembourg	Satellite operator developing 5G Non Terrestrial Network connectivity for global coverage.	Satellite 5G NTN, space-based connectivity
PICAdvanced	Portugal	Photonics integration company producing engines for high speed optical communications across access to data centre links.	Photonic integrated circuits, optical transceivers
Quside Technologies	Spain	Designs quantum random number generators and quantum technologies for connected devices, citing SP800-90B compliance.	Quantum random number generation, cryptography
SemiQon Technologies	Finland	Develops silicon-based quantum processors and cryo-optimized CMOS to make quantum computing components more affordable and scalable.	Silicon quantum processors, cryo-CMOS
TechNovator	Poland	Promotes a wireless charging system based on energy quantisation concepts claiming high efficiency at a distance.	Wireless power transfer, novel charging tech
Video Systems	Italy	Provides advanced artificial vision and intelligence for industrial quality control and monitoring.	Machine vision, industrial AI
Voxel Sensors	Belgium	Develops a low-bandwidth, low-power sensing pipeline suitable for smart glasses, producing data for AI systems.	Edge sensing, wearable sensors, low-power telemetry

What the EIC International Trade Fairs Programme 3.0 offers

The ITF 3.0 package is pitched to help EIC awardees maximise impact at trade fairs. The stated services include a dedicated booth at the EIC Pavilion, personalised business coaching, targeted matchmaking with investors and corporates, and visibility and promotion support. The programme builds on the previous OTF 2.0 initiative and runs across 2024 to 2026 covering multiple strategic trade fairs in Europe, the MENA region and the United States.

Matchmaking and coaching explained:Matchmaking typically combines curated one-on-one meetings, reverse pitch sessions with corporates and investors, and investor dinners. Coaching focuses on market strategy, pitching, and practical preparation for on-site activities. These services increase the probability of useful contacts but converting meetings into pilots, contracts or investment still requires sustained follow-up and operational capacity from the participating companies.

Schedule and preparations

Selected companies will join an online pre-departure briefing on 3 February 2026 with EIC representatives and market experts. In the weeks before MWC they will receive additional coaching to refine business approaches and pitching, and will participate in structured matchmaking exercises such as reverse pitch sessions and one-on-one meetings. Onsite activities include panels, demos, and investor-facing events. Companies were shortlisted through open calls organised by the EIC and external reviewers.

Key terms and technologies explained

NR+ (non cellular 5G) and LM10XX SoC:NR+ is presented by some companies as a license free, non cellular variant of 5G designed for massive IoT and private networks. Last Mile Semiconductor markets its LM10XX SoC based on NR+ with an integrated RISC V core and hardware security. Independent adoption of any new radio standard requires ecosystem support, device certification and regulatory alignment across jurisdictions.

LiFi:Light Fidelity or LiFi uses modulated light, typically infrared or visible LEDs, to transmit data. LiFi confines signals to physical spaces making it attractive for secure or RF restricted environments. Limitations include line of sight constraints and integration with existing IP networks. Companies like Oledcomm position LiFi for security sensitive, industrial and aerospace use cases.

Quantum random number generators (QRNG) and certification:QRNGs use quantum processes to generate entropy for cryptographic keys. Quside promotes photonic QRNGs and references compliance with NIST SP800-90B, a NIST standard for entropy sources. Certification matters for financial and governmental deployments where provable randomness and compliance frameworks are required.

Non Terrestrial Networks (NTN) and 3GPP:NTN refers to satellite and airborne elements integrated into mobile networks. 3GPP has standardised NTN functionality in recent releases, enabling satellite operators to offer more interoperable 5G services. Companies claiming 5G NTN services must demonstrate interoperability and comply with 3GPP releases and national telecom regulators.

Photonics and photonic integrated circuits (PICs):PICs pack optical functions on silicon or other substrates to reduce cost and footprint for high speed optical communications. Firms such as PICAdvanced focus on design, packaging and testing of PICs for access and data center applications. Integration across electronics and optics remains a production challenge.

Cryo-CMOS and silicon quantum processors:Cryo-CMOS refers to CMOS circuits optimised to operate at cryogenic temperatures, which are necessary for some quantum computing architectures. SemiQon is working on silicon quantum processors and cryo-optimised transistors to reduce cabling and power in quantum systems. These developments aim to address scaling bottlenecks but broad commercialisation will require ecosystem manufacturing readiness.

A pragmatic view on benefits and risks

Trade fairs like MWC and 4YFN provide valuable concentrated access to buyers, partners and investors. For deep-tech companies the potential gains include pilots with corporates, investor contacts and media exposure. However, expectations should be calibrated. Converting meetings into revenue or funding requires product readiness, clear use cases, local regulatory planning and follow-up resources. Publicised selection and visibility are helpful but not sufficient to guarantee scale up.

From an ecosystem perspective the EIC ITF Programme aims to reduce market entry friction for EIC beneficiaries and to complement grant or equity support. Yet longstanding structural barriers remain in Europe such as fewer late stage deep-tech investors compared to the United States. The EIC Fund and co-investment signals help but sustained scale-up also depends on domestic industrial partnerships, procurement pipelines and access to talent.

How companies and stakeholders can follow or engage

The EIC Community platform hosts programme information, open calls and stories from previous missions. Selected companies will attend panels and demos in the EIC Pavilion and 4YFN. EIC beneficiaries or interested organisations can contact the EIC Community Helpdesk using the category EVENT – EIC ITF Programme – MWC 2026 for queries. The EIC Business Acceleration Services newsletter provides updates on open calls and support services.

Practical note on eligibility and the ITF 3.0 programme

ITF 3.0 is open to startups, SMEs and scaleups that have received EIC support and which present a clear commercialisation strategy for the trade fair market. Calls are published on the EIC Community platform roughly six months before events. Selection is carried out through open calls and expert review. The programme runs through 2026 with multiple fairs in the EU, the MENA region and the USA.

Final observations

The EIC delegation at MWC 2026 highlights a cross section of Europe's deep tech strengths in photonics, quantum, secure connectivity and industrial AI. The EIC's trade fair support reduces logistical and promotional barriers for beneficiaries. Yet observers should track measurable outcomes such as deals closed, pilots launched and follow-on investment to evaluate long term impact. Trade fairs are a catalyst but durable scale-up hinges on execution, market fit and sustained capital.

Contact and further information

For questions about the EIC International Trade Fairs Programme contact the EIC Community Helpdesk and select EVENT – EIC ITF Programme – MWC 2026. To receive programme updates and notifications from the EIC Business Acceleration Services subscribe to the EIC BAS newsletter via the EIC Community platform.

Disclaimer: The information in this article is based on material published by the EIC and participating companies. Company descriptions are claims made by the companies on their public pages and have not been independently verified by this author. Participation in trade fairs does not guarantee commercial success.