How EIC trade fair support helped Multiverse Computing turn compressed AI into an on‑device partnership with Axelera AI

Brussels, July 30th 2026
Summary
  • Multiverse Computing used EIC trade fair support at GITEX Global 2024 and CES 2025 and 2026 to build commercial traction and partnerships.
  • A strategic alliance with fellow EIC-backed Axelera AI pairs Multiverse's compressed models with specialised hardware to offer a European on-device AI stack.
  • The company attributes roughly EUR 1 million in revenue and EUR 2 million in new investment to trade fair engagement, and reports rapid growth in ARR and headcount after a June 2025 funding round.
  • The case illustrates how the EIC Business Acceleration Services can help connect deep-tech software and hardware innovators, while raising questions about attribution and execution risks in scaling on-device AI.

From pavilion visibility to a hardware partnership How Multiverse Computing leveraged EIC trade fairs

Multiverse Computing, an EIC Accelerator awardee founded in 2019, says that exhibiting in the European Innovation Council pavilion at GITEX Global 2024 and CES 2025 and 2026 produced measurable commercial outcomes. The Spanish deep-tech company, which reoriented from quantum software into AI model compression in 2023 and 2024, reports new customers, investor interest and a strategic software‑hardware partnership with Axelera AI. The company credits the EIC International Trade Fairs Programme and accompanying business acceleration services for facilitating introductions, meeting organisation and visibility that helped convert leads into deals and investment.

What Multiverse Computing does and why it matters

Multiverse Computing began as a quantum software firm. In recent years it has applied proprietary methods to compress large AI models so they can run locally on constrained devices. The company argues that compressed models reduce cost, latency and connectivity dependence. This enables applications that would otherwise require cloud compute to operate on the device itself in settings that prioritise privacy, offline operation or tight power budgets.

Model compression explained:Model compression covers techniques that shrink neural networks without degrading accuracy beyond acceptable thresholds. Methods range from quantisation, pruning and knowledge distillation to more specialised approaches such as tensor network factorisation. The aim is to reduce memory footprint, computational operations and energy consumption so models can run on embedded processors or specialised AI accelerators. The trade off is often engineering work to preserve robustness, maintainability and explainability of the compressed model.
On-device AI benefits and limitations:Running AI locally can lower latency, reduce ongoing cloud costs and improve data privacy because sensitive data does not need to leave the device. It can also enable new use cases in areas with intermittent connectivity. The main limitations are that local hardware is constrained in CPU, memory and power. Even with compression, models must be validated thoroughly across diverse real-world inputs. Integrating software and hardware across supply chains adds commercial and technical complexity.

How EIC trade fairs fit into a commercialisation strategy

Multiverse Computing displayed at the EIC Pavilion at GITEX Global 2024 in Dubai and at CES 2025 and 2026 in Las Vegas. The company says the EIC programme provided booth visibility, curated introductions and meeting support. For deep-tech firms working at the software-hardware boundary, trade fairs offer rapid access to device manufacturers, system integrators and potential investors that are otherwise hard to convene for head-to-head validation conversations.

EventLocation and YearCompany activities at EIC PavilionReported outcomes attributed to trade fair engagement
GITEX GlobalDubai 2024Exhibited at EIC Pavilion. Initial introductions with Axelera AI and regional investors. Participated in pavilion programming and reverse pitches.First connection with Axelera AI. Conversations with Middle East investors initiated.
CESLas Vegas 2025Exhibited at EIC Pavilion. Follow up meetings and continued discussions with Axelera AI and device manufacturers. Investor outreach and MWC follow ups.Reported generation of approximately EUR 1 million in revenue following CES 2025 and increased investor interest leading to around EUR 2 million in new investment.
CESLas Vegas 2026Exhibited and participated in panel discussions on the EIC stage. Advanced partnership talks and credibility-building with corporates.Deepened strategic alignment with Axelera AI and contributed to pipeline growth. Ongoing investor and partner engagements.

The Axelera AI partnership What was announced

Multiverse Computing and Axelera AI, both EIC-backed, developed a commercial partnership that combines Multiverse’s compressed AI models with Axelera’s hardware. The stated goal is to deliver a complete European on-device AI solution in which Multiverse provides optimised models and Axelera supplies the specialised chip and hardware integration. Multiverse positions the alliance as a way to offer customers a ready-made software and hardware stack from Europe.

Why a combined software and hardware offer matters:Device manufacturers prefer integrated solutions that reduce engineering lift and speed time to market. A validated stack that pairs compressed models with a compatible accelerator helps buyers evaluate performance, power and cost trade offs. Building such a stack requires system integration work and ongoing co‑optimisation as models and silicon evolve.

The partnership is an illustrative example of what the EIC ecosystem is designed to do which is to connect complementary innovators. It also highlights the practical challenges ahead. Successful scaling will depend on engineering integration, long term support agreements, supply chain security and commercial deals with device OEMs. The announcements to date describe a business relationship but do not disclose detailed deployment agreements or unit economics.

Commercial and financial outcomes reported by Multiverse Computing

Multiverse Computing attributes several concrete outcomes to its participation in EIC trade fair programmes and related activities. The company reports approximately €1 million in revenue following CES 2025 and around €2 million in new investment sourced from public investment organisations and private investors engaged through events including CES and Mobile World Congress. Multiverse also cites validation from engagements with consultancies such as PwC and participation of HP in its Series B funding round.

Beyond those figures the company reports rapid operational scale up. After a funding round completed in June 2025 Multiverse says annual recurring revenue reached USD 100 million and headcount increased from roughly 250 to more than 450 employees. Europe remains the primary market. Canada is cited as the second largest market supported by a Toronto office and partnerships including Cohere. The company is also building sales presence in California to target larger US device manufacturers and continues discussions with Middle East investors initiated at GITEX.

A skeptical reading of the numbers and claims

These results are notable if accurate. At the same time it is important to separate correlation from causation. Trade fairs are one channel among many for investor outreach and customer acquisition. The EIC programme provides matchmaking and visibility which can accelerate introductions. But the conversion of leads into revenue and investment also depends on product readiness, existing sales cycles, prior relationships and follow up activities such as demos and pilots. Public communications from companies tend to emphasise positive impacts of programmes that supported them which is reasonable. Independent verification and fuller financial detail would be needed to precisely attribute revenue and funding to any single programme or event.

Wider implications for Europe and for other deep-tech innovators

Multiverse’s story touches on two policy priorities for Europe. First it shows the potential to build a European on-device AI stack that combines sovereign software and hardware. That is a strategic goal for policymakers seeking technological autonomy and supply chain resilience. Second it demonstrates how targeted market access services and trade fair support can accelerate commercial conversations that are hard to achieve from a distance.

Limitations and risks to watch:Delivering on-device AI at scale requires continuous co-optimisation between model creators, silicon designers and OEM integrators. Shifts in architectures, model updates and divergent hardware roadmaps create maintenance burdens. Commercial success depends on convincing device manufacturers that integration costs are outweighed by benefits in performance, cost and privacy. Geopolitics, trade restrictions and supply chain constraints can also complicate efforts to build a pan-European hardware-software supply chain.

What the EIC International Trade Fairs Programme 3.0 provides

EIC International Trade Fairs Programme 3.0 explained:The programme is part of the EIC Business Acceleration Services. It offers selected EIC-funded SMEs, start-ups and scale-ups from EU Member States and Associated Countries access to exhibition space at around 20 international trade fairs together with matchmaking, meeting facilitation and pre-event coaching. The service aims to increase visibility, support targeted introductions and help awardees test demand and build partnerships in foreign markets.

The EIC Business Acceleration Services portfolio includes a wide range of market access and investor readiness initiatives. For innovators considering participation the programme is worth evaluating for the curated contacts and logistical support it offers. Companies should budget for follow up activities and pilots that convert initial interest into procurement contracts and repeatable revenue streams.

Practical takeaways for founders and policymakers

Founders should treat trade fairs as part of a structured go-to-market process. Success requires pre-event preparation, targeted customer and investor meetings, on-site demos, and a disciplined follow up plan. Public support can open doors but not replace the commercial work of pilots, integration and long sales cycles with device makers.

Policymakers should recognise that connecting hardware and software innovators can accelerate value chain formation. But they should also be realistic about timelines. Building sovereign stacks that can compete globally requires sustained investment in silicon, tools, talent pools and standards. Programmes that offer introductions are valuable. They are most effective when accompanied by co-investment mechanisms and downstream procurement opportunities that help turn pilots into scaled deployments.

How to follow up or learn more

Multiverse Computing, Axelera AI and the EIC publish case material and programme details on the EIC Community portal. Awardees interested in trade fair support can consult the EIC Business Acceleration Services pages and contact the EIC Community Helpdesk selecting "EVENT - EIC ITF Programme" as the subject. As with all programme claims it is advisable to request concrete metrics and references when assessing the likely impact on a specific commercial roadmap.

Contact pointWhat it providesWhere to find it
EIC Business Acceleration ServicesTrade fair access, matchmaking, coaching, investor outreach and other market access services.EIC Community portal and EIC BAS pages
EIC International Trade Fairs Programme 3.0Exhibition space at selected fairs, meeting organisation and visibility support for EIC awardees.Apply via the EIC Community and contact the EIC Helpdesk
Multiverse ComputingCommercial compressed AI models for edge deployment and partnerships with hardware providers.Company press releases and corporate channels for product and partnership information