How the European Innovation Council Staged a Coordinated Deep‑Tech Push at CES 2026

Brussels, January 20th 2026
Summary
  • From 6 to 9 January 2026 the European Innovation Council led a coordinated EU presence at CES with an EIC Pavilion showcasing EIC-backed deep tech companies.
  • The pavilion combined company exhibits with a co-curated European programme of panels on AI sovereignty, compute, industry 4.0, assistive tech, energy-efficient edge computing and market scaling.
  • .lumen won a CES 2026 Innovation Award in Accessibility & Longevity and received a $10,000 prize.
  • The activity was part of the EIC International Trade Fairs Programme 3.0 which offers coaching, matchmaking and exhibition support for EIC beneficiaries.
  • The EIC presence highlights EU institutional coordination and market diplomacy while outcomes will depend on follow-through from matchmaking, investment and commercialisation.

How the European Innovation Council Staged a Coordinated Deep‑Tech Push at CES 2026

From 6 to 9 January 2026 the European Innovation Council convened a delegation of EIC-backed deep‑tech companies at CES in Las Vegas. The event combined exhibition space, a co-curated European stage programme, workshops on funding, investor reverse pitches and an evening networking reception. The EIC framed the presence as Europe speaking with one coordinated voice on areas including AI, cloud, cleantech, fintech, semiconductors and industry 4.0.

The pavilion marked the EIC’s sixth participation at CES and was inaugurated with a ribbon cutting attended by the EU Ambassador to the United States Jovita Neliupšienė and Stéphane Ouaki, Head of the EIC at EISMEA. The Consumer Technology Association also participated in opening activities.

Who exhibited and what they showcased

The EIC Pavilion hosted a cohort of companies supported by the EIC across 11 European countries, supplemented by three additional EIC-backed firms who attended the show. The participants represented a mix of hardware, software, medical and IoT-focused deep tech.

CompanyCountryArea of focus
Axiles BionicsBelgiumAnkle-foot prostheses and assistive mobility
EmbedlSwedenEdge AI model optimisation and SDKs
InvoierSwedenInvoice financing marketplace
Iris.aiNorwayAgentic RAG AI development and operations platform
Last Mile SemiconductorGermanyNR+ System on Chip for smart edge connectivity
MorphotonicsNetherlandsLarge-area nanoimprinting for optics and displays
Multiverse ComputingSpainModel compression, quantum‑inspired algorithms and optimisation
ONiONorwayUltra low power, energy-harvesting capable microcontrollers
Simplicity WorksSpain3D Bonding materials assembly
SiPearlFranceHigh performance processors for HPC and AI inference
VideantisGermanyScalable SoC platform for AI and video processing
Video SystemsItalyAI edge systems for industrial vision and real-time processing
VSORAFranceHigh performance compute architectures for AI workloads
Axelera AINetherlandsEdge AI accelerators and AIPUs
BOYDSenseFranceNon-invasive breath analysis for health monitoring
.lumenRomaniaWearable autonomous navigation for visually impaired users

Programme and sessions on the EIC stage

For the first time at this scale EIC partners and European counterparts delivered a co‑curated programme on the pavilion stage. That programme combined thematic panels, policy and market sessions and country led briefings under a single European banner. The organisers highlighted five strategic sessions aimed at connecting Europe and the U.S., explaining co‑funding and scale pathways, and showcasing technology excellence.

The five strategic sessions were titled Transatlantic bridges, Scaling Deep Tech globally, Female founders shaping the future of tech, Edge‑to‑Orbit IoT and Human‑Centric Tech. In addition a lineup of six thematic panels addressed sector priorities including AI sovereignty, European compute for AI and quantum, assistive technologies, factory intelligence, sustainable edge compute and converting data into commercial deals.

Transatlantic bridges:A session focused on creating connections between European and U.S. ecosystems to accelerate partnerships, investment and market entry for EIC-funded innovators. It discussed practical routes to market and regulatory and commercial frictions that typically confront international scaling.
Scaling Deep Tech globally:This session examined co-funding and growth pathways and how EIC and member state programmes can combine to provide co-investment, growth capital and international market access while emphasising strategic autonomy.
Edge-to-Orbit IoT:Described as global connectivity for smart infrastructure, this showcase considered hybrid connectivity that fuses terrestrial networks and satellite links for resilient, energy‑aware IoT deployments. The idea is to build architectures that move data and computation where it is most efficient.
Human-Centric Tech:Panels in this stream demonstrated assistive wearables, flexible displays and robotics designed for safety and accessibility and discussed routes to certification and reimbursement in health markets.

Panels of practical interest to startups

Session topics were targeted at technical and commercial challenges that matter to deep tech founders. Among the panels were:

AI Sovereignty. The session explored concepts around data sovereignty, edge compute and sovereign hardware and software. Discussions touched on tradeoffs between local control, interoperability and the economics of custom stack development.

AI, Quantum and HPC. This panel reviewed European work on quantum algorithms, high performance processors and AI acceleration and how compute stacks need to evolve for next generation models.

Restoring Ability. Focused on human‑centric deep tech, this showcased digital health and assistive tech with conversations about clinical validation, regulatory pathways and adoption barriers in health systems.

Factory Intelligence. Case studies showed how automation, precision optics and connected IoT modules can improve manufacturing productivity.

Powering the Edge Sustainably. This explored storage, energy harvesting and low‑power compute designs that reduce the energy footprint of distributed digital systems.

Data to Deals. A closing session that highlighted privacy‑centric AI and fintech platforms able to transform data into business insights and liquidity.

Reverse pitches and investor panels:Alongside the panels the Pavilion ran reverse pitch sessions where investors, system integrators and legal experts such as Cathay Innovation, AIOTEK, Kilpatrick Townsend and Orrick presented what they seek from startups. Reverse pitches help founders sharpen go-to-market asks but do not guarantee funding.

Pavilion activities, networking and European Night

The EIC complemented the exhibition and stage programme with targeted business services. These included pre-departure briefings, coaching on EIC funding and Business Acceleration Services, B2B matchmaking and tailored on-site support. The Pavilion also hosted an evening reception called European Night co‑hosted with national delegations from Belgium, Croatia, Estonia, France, Germany, Hungary, Italy, the Netherlands and Switzerland and the organisation Choose Europe. The invitation-only event gathered more than 230 guests including investors and corporate leaders.

Awards and notable exhibitor outcomes

One high-profile recognition was the CES Innovation Award in the Accessibility & Longevity category awarded to .lumen for its Glasses for the Blind. The product uses sensors and AI to guide users via haptic feedback and was singled out from more than 3,600 submissions. In addition to the award, .lumen received a $10,000 prize. Cornel Amariei, CEO and founder of .lumen, said the company’s early EIC‑supported trips to CES changed their thinking about global impact.

Past EIC communications highlight earlier measurable outcomes from trade fair participation. That history is relevant but should not be read as a guaranteed outcome for every participant. Converting visibility and meetings at trade fairs into contracts, pilots, or investment requires sustained follow up and commercial traction beyond the event itself.

Context and critical perspective

The EIC’s CES operation is a visible exercise in tech diplomacy and ecosystem building. By aligning EU institutions, Member State delegations and innovation actors the pavilion amplified European visibility at one of the world’s largest tech marketplaces. That coordination can help start-ups access networks and investor audiences that are otherwise hard to reach.

That said, such moments of visibility are the start of a commercialisation process not the end. Practical challenges remain. Founders still must prove product‑market fit, negotiate complex procurement chains, secure regulatory approvals, and, in many hardware cases, scale manufacturing. Public programmes can lower the cost of market testing but they do not replace the need for private follow‑on capital or corporate buyers.

What success looks like and what to watch for:Short term wins include investor meetings, pilots signed, and initial purchase orders. Medium term metrics to track are pilot conversion rates, follow‑on funding raised, and revenues attributable to the trade fair engagement. Independent verification of claimed deals and revenues is important whenever outcomes are reported.

Explainer: selective technical and programme concepts

EIC International Trade Fairs Programme 3.0:A European Commission managed initiative running from 2024 to 2026. ITF 3.0 helps EIC awardees attend international trade fairs across the EU, the Middle East and the United States. Services include exhibition space, tailored coaching, pre‑departure market briefings, B2B matchmaking and follow‑up mechanisms. Eligible applicants are EIC beneficiaries with market‑ready products. Calls open roughly six months before each fair and applications are evaluated by external experts.
AI sovereignty:A policy and technical concept about where data, models and compute live. For governments and firms it combines concerns about data protection, supply chain resilience, and control over critical software and hardware. Practically it can mean building local compute stacks, trusted hardware, or contractual safeguards rather than strict geographic isolation of AI development.
Agentic RAG and Iris.ai style platforms:Retrieval Augmented Generation or RAG augments large language models with external knowledge stores. Agentic RAG describes systems that orchestrate multiple retrieval and reasoning steps with autonomous agents. Platforms that support agentic RAG aim to provide toolchains for building, evaluating and operating such production systems while ensuring governance and cost control.
Edge-to-Orbit IoT:An architecture that combines terrestrial edge networks and satellite connectivity. It is useful for geographically distributed infrastructure where coverage gaps and resilience are important. Technical tradeoffs include latency, energy consumption, security and the cost of dual connectivity stacks.
Energy-harvesting compute and ultra-low-power MCUs:Technologies such as those shown by ONiO aim to operate microcontrollers from ambient sources of energy like light or RF. Energy harvesting reduces maintenance costs linked to batteries but requires extreme power efficiency in both hardware and software and design choices that consider duty cycles, storage and environmental variability.
NR+ and Last Mile Semiconductor’s claim:Last Mile Semiconductor promotes the LM10XX SoC using NR+, described by the company as a globally free, non‑cellular 5G standard. This type of industry claim should be understood as vendor positioning. Adoption of any radio technology depends on ecosystem support, spectrum regulation in specific countries and the availability of chipsets and module suppliers.

Programme mechanics, help and next steps for founders

The EIC ITF 3.0 runs trade fair participation across multiple events. EIC beneficiaries interested in ITF support must be EIC awardees and apply via open calls published on the EIC Community platform. Applications request alignment with the trade fair objectives, the company’s internationalisation strategy and commercial preparedness. External experts evaluate submissions. The EIC Community helpdesk handles enquiries when applicants select 'EIC International Trade Fairs Programme' as the subject.

Upcoming trade fairs under ITF 3.0LocationDates
CES InternationalLas Vegas, USA6 - 9 January 2026
Mobile World CongressBarcelona, Spain2 - 5 March 2026
GITEX AfricaMarrakech, Morocco7 - 9 April 2026
BIO International ConventionBoston, USA22 - 25 June 2026
GITEX EuropeBerlin, Germany30 June - 1 July 2026
MEDICADusseldorf, Germany9 - 12 November 2026
GITEX GlobalDubai, UAE9 - 11 December 2026

Practical takeaways for policy makers, investors and founders

For policy makers a coordinated show like this is a visible instrument of innovation diplomacy. It can amplify the reach of funded companies and attract partner corporates and investors. For investors and corporate scouts CES provided a concentrated window to meet validated, EIC‑backed startups and explore pilot opportunities. For founders the pavilion offered reduced-cost access to a top global stage, coaching and matchmaking. The caveat is that conversion to pilots, contracts or funding requires significant post-show effort.

Organisers point to success stories from past editions to justify the programme. Independent monitoring of post-event business outcomes will be useful to assess return on public support and to refine future editions of the ITF programme.

How to follow up and where to find more information

EIC materials include a recap video of the CES week at https://youtu.be/EqTacu0KheI and additional information on the EIC Community platform. For companies interested in the ITF 3.0 programme the EIC Community helpdesk provides guidance. The EIC stresses this content is for knowledge sharing and not the official view of the European Commission or other organisations.