EIC-backed Treble and Last Mile Semiconductor raise profile at IFA Berlin as investor outreach pushes EU deep tech visibility
- ›The EIC supported two Accelerator awardees, Treble Technologies and Last Mile Semiconductor, to exhibit and speak at IFA Berlin on 5 September 2025.
- ›A panel titled Electronics, Innovation & Creativity examined Europe’s role in consumer electronics, the role of public funding, scaling strategies, and the impact of AI and immersive tech.
- ›Treble showcased a high-fidelity 3D audio simulation platform it says is 100 times faster than alternatives, aimed at gaming, entertainment and architecture.
- ›Last Mile Semiconductor demonstrated a non-cellular 5G variant called NR+ for low-cost IoT connectivity in hard to reach or cost-sensitive areas.
- ›The appearances improved visibility and investor contact but do not by themselves prove commercial traction or regulatory readiness.
- ›The case highlights the EIC Investor Readiness and Outreach Programme as a key channel for moving EU deep tech toward private capital while exposing persistent scaling and standards challenges.
EIC awardees Treble Technologies and Last Mile Semiconductor at IFA Berlin
Through the EIC Investor Readiness and Outreach Programme the European Innovation Council supported two EIC Accelerator awardees to attend IFA Berlin on 5 September 2025. Both companies appeared on a high profile panel and ran exhibition booths. The activity was presented as a way to increase investor visibility and to position European deep tech start ups at one of the continent's largest consumer electronics gatherings.
Panel discussion: Electronics, Innovation and Creativity
The panel titled Electronics, Innovation and Creativity was moderated by Sascha Quade. Panellists included Ekke Van Vliet, Investment Coordinator at the EIC, Kristján Einarsson, Marketing Director at Treble Technologies, Mario Orgis, CTO and Co founder at Last Mile Semiconductor, and Mali M. Baum from WLOUNGE. The discussion covered Europe’s position in the global innovation ecosystem the interface between public funding and private capital scaling strategies and the disruptive potential of AI and immersive technologies.
For the start ups the panel offered exposure to investors industry contacts and potential customers. For the EIC it served to illustrate how public funding can surface promising deep tech. Public showcasing at IFA improves visibility but it does not replace the practical steps needed for market entry such as pilots regulatory clearance and long term commercial contracts.
Treble Technologies: pioneering faster 3D audio simulation
Treble Technologies presented a platform for high fidelity acoustic simulation aimed at creating immersive soundscapes for gaming entertainment architecture and live events. The company claims its simulation engine is 100 times faster than existing solutions which, if validated, would be significant for real time and interactive applications.
At IFA Treble ran live demonstrations allowing visitors to experience its platform. The EIC supported the company by introducing relevant investors and facilitating participation in showcasing and pitching events. The target customers include game developers event organisers architects and other industries that require precise simulated acoustic environments. Commercial adoption will depend on integration with existing audio toolchains commercial licensing models and proof that the speed improvements do not materially degrade perceived quality.
Last Mile Semiconductor: non cellular 5G for IoT
Last Mile Semiconductor demonstrated a version of 5G they label NR plus or NR+. The company positions NR+ as a low cost non cellular connectivity solution for IoT deployments where traditional cellular is too expensive unavailable or power hungry. Typical use cases presented include remote agriculture industrial IoT and smart infrastructure.
Last Mile says EIC Accelerator support accelerated development and helped build industry partnerships. The IFA demonstration focused on how NR+ could unlock connectivity where conventional mobile networks struggle. Real world deployment will require attention to spectrum licensing rules across countries conformity to 3GPP releases or justification for deviations and convincing ecosystem partners to adopt new silicon and modules. Scalability will also depend on manufacturing cost and the availability of device and gateway ecosystems.
Comparative snapshot
| Attribute | Treble Technologies | Last Mile Semiconductor |
| Core technology | High fidelity 3D acoustic simulation engine | Non cellular 5G variant labelled NR+ for IoT connectivity |
| Claimed performance advantage | 100 times faster than existing solutions | Lower cost and energy use compared with traditional cellular IoT |
| Target sectors | Gaming, entertainment, architecture, events | Remote agriculture, industrial IoT, smart infrastructure |
| EIC support provided | Investor introductions, show and pitching facilitation via Investor Readiness Programme | EIC Accelerator funding and Investor Readiness outreach including introductions and showcasing |
| Near term validation | Live demos at IFA; needs independent benchmarks under production conditions | Live demos at IFA; needs regulatory and interoperability validation |
| Primary risks and hurdles | Verification of speed versus accuracy trade offs, integration with toolchains, monetisation | Spectrum and standards compliance, device ecosystem adoption, production scale and certification |
What a trade show appearance achieves and what it does not
Events like IFA deliver visibility media attention and networking opportunities with potential customers and investors. For early stage deep tech companies that exposure can accelerate conversations and open doors to pilot projects. However trade shows are a partial measure of progress. They do not prove readiness for large scale deployments nor do they substitute for technical audits regulatory approvals long term contracts or the capital needed for manufacturing scale up.
Policy and ecosystem implications
The EIC Investor Readiness and Outreach Programme sits within a broader EU effort to turn research and prototypes into scalable companies and strategic capabilities. Public funding can de risk early steps and attract private investors by improving governance and commercial preparedness. The showings by Treble and Last Mile at IFA illustrate the pipeline from public support to market facing outreach. They also expose recurring issues in the European deep tech landscape such as the need for larger follow on financing credible third party validation and clearer pathways for regulatory and standards compliance.
For policymakers the lesson is familiar. Funding and visibility matter but must be coupled with mechanisms that reduce commercial and regulatory friction. For investors the message is to treat demo claims as the start of due diligence not its conclusion.
Next steps and where to follow developments
Both Treble and Last Mile will need to convert visibility into pilots and contractual commitments to demonstrate commercial viability. The EIC programme continues to provide matchmaking and investor lists for awardees. Interested investors and partners can follow EIC Business Acceleration Services updates and the EIC Investor Readiness outreach communications for future pitch events and introductions.